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- Here are examples of some of my work. The information has been
edited to protect proprietary information.
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Temperature Gradient Induced Stress and Strain
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Plastic Polymer Injection Mold - FEA using flexPDE
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Heat Flux in a Silicon MEMS Wafer with Internal Heat Source
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Heat Flux in a
MEMS WAFER - FEA using flexPDE
Comments Regarding
my Heat and Thermal Flux Design and Analysis Work:
- The measurement and analysis of
temperature and heat flow in electrophysical systems becomes necessary in
many circumstances. Over the years, I have done a fair amount of thermal
measurement and analysis, with more recent work being related to the
stresses and strains induced by temperature gradients in bolted
and adhesively bonded micro-fluidic structures.
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- The analysis of heat flux generated stress and strain is inherently
"multiphysics" ... the various fields to be solved for being cross-coupled.
Often, as in the case for thermal gradient induced buoyant fluid flow, the
partial differential equations are highly non-linear. In any case, an extra layer
of interesting physics is introduced when the media through which the fields
propagate are non-isotropic. I have made finite element analysis ( FEA
) studies for these and other cases of practical use in applied science and
engineering.
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- Also, I once extensively
modified and temperature calibrated a video camera with near infrared
sensing capability, to allow its use in monitoring a huge pulp and paper mill
Kraft Recovery furnace.
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